[PDF] IEC 60966-3-2:2003 gratis
Fecha de publicación: 11/08/2003 Radio frequency and coaxial cable assemblies – Part 3-2: Detail specification for semi-flexible coaxial cable assemblies for GSM use (0,8 GHz – 1 GHz) IEC 60966-3-2:2003
Fecha de publicación: 11/08/2003 Radio frequency and coaxial cable assemblies – Part 3-2: Detail specification for semi-flexible coaxial cable assemblies for GSM use (0,8 GHz – 1 GHz) IEC 60966-3-2:2003
Fecha de publicación: 11/08/2003 Connectors for electronic equipment – Tests and measurements – Part 10-4: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests – Test 10d: Electrical overload (connectors) IEC 60512-10-4:2003
Fecha de publicación: 21/08/2003 Insulating materials – Industrial rigid moulded laminated tubes and rods of rectangular and hexagonal cross-section based on thermosetting resins for electrical purposes – Part 3-1: Specifications for individual materials – Tubes and rods of rectangular and hexagonal cross-section IEC 62011-3-1:2003
Fecha de publicación: 26/08/2003 Optical amplifiers – Test methods – Part 3-1: Noise figure parameters – Optical spectrum analyzer method IEC 61290-3-1:2003
Fecha de publicación: 03/10/2003 Optical amplifiers – Test methods – Part 5-2: Reflectance parameters – Electrical spectrum analyser method IEC 61290-5-2:2003
Fecha de publicación: 08/10/2003 Surface acoustic wave (SAW) filters of assessed quality – Part 3: Standard outlines IEC 60862-3:2003
Fecha de publicación: 09/10/2003 Metallic communication cables test methods – Part 1-1: Electrical – Measurement of the pulse/step return loss in the frequency domain using the Inverse Discrete Fourier Transformation (IDFT) IEC 62153-1-1:2003
Fecha de publicación: 27/10/2003 Metallic communication cable test methods – Part 4-2: Electromagnetic compatibility (EMC) – Screening and coupling attenuation – Injection clamp method IEC 62153-4-2:2003
Fecha de publicación: 04/11/2003 Corrigendum 1 – Connectors for electronic equipment – Part 4-101: Printed board connectors with assessed quality – Detail specification for two-part connector modules, having a basic grid of 2,0 mm for printed boards and backplanes in accordance with IEC 60917 IEC 61076-4-101:2001/COR1:2003
Fecha de publicación: 12/11/2003 Materials for printed boards and other interconnecting structures – Part 2-11: Reinforced base materials, clad and unclad – Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad IEC 61249-2-11:2003